Board-Level Assembly
BOARD-LEVEL ASSEMBLY

Whether you need prototypes, low volume or high volume production, we support a wide range of board-level technologies including:
  • Through-hole
  • SMT
  • BGA, microBGA, CGA, Flip Chip
  • Lead-free processing
  • RF Technology.

 

Our engineering team will work with you on design for manufacturability and design for testability (DFM/DFT) requirements. Ask for our free 102-page DFM/DFT Guide To Getting Increased Yields and Higher Reliability. It will give your designers the insight needed to design and develop the most stable, high yield and defect-free competitive products possible.

 
 
 
 
 
 
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